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Mark Ruberto is an experienced Patent Agent with 20 years of industrial experience. He drafts and prosecutes patents, conducts patentability assessment, and prepares Office Action responses. Mark handles patents in microelectronics, packaging, integrated circuit design, radio-frequency (RF) and millimeter-wave design, communications, optoelectronics, wireless, networking, medical devices, bioelectronics, computer systems, petrophysics, cryptography, and security systems.


  • Drafting and prosecution of patents for the U.S. and other jurisdictions
  • Preparation of responses to USPTO, Chinese, and European Patent Office Actions
  • Patentability assessment
  • Physics, electrical engineering, computer engineering, and biomedical engineering



  • Advised ITT Inc. (NYSE: ITT) as part of their acquisition of Israeli valve manufacturer Habonim.
  • Postdoctoral Research Fellow, Technion-Israel Institute of Technology, 1992-1994
  • “Conformal Phased Array Antenna with Integrated Transceiver”; U.S. Pat. Pub. US 2014/0225805
  • “Integrated Phased Array Transmit/Receive Module”; U.S. Patent No. 8,467,737
  • “Transistor and Routing Layout for a Radio Frequency Integrated CMOS Power Amplifier Device”; U.S. Patent No. 7,705,684
  • “A Method of Localized Photochemical Etching of Multilayered Semiconductor Body”; U.S. Patent No. 5,081,002
  • Senior Design Engineer and R&D Project Leader, Intel Corporation, Haifa Design Center, 2003-2012
    • Advanced Radio Technology R&D Team, 2007-2012
    • RFIC Product Design Team, 2003-2007
  • Manager, Microwave Technology Integration for Microwave/MMWave Subsystems, Rastech Wireless Systems, MATAM, 2000-2003
  • Technical Staff Member, High Speed Circuit Design Group, IBM Haifa Research Laboratories, MATAM, 1999-2000
  • Research Engineer, Microwave Group, Rafael Advanced Defense Systems, 1994-1999
  • Adjunct Faculty, Department of Electrical Engineering, Technion-Israel Institute of Technology, 2002
  • Lecturer, “Solid State Devices,” Department of Electrical Engineering, Columbia University, 1988
  • Designed receivers and transmitters of the RF chips used in Intel Corporation’s first Wi-Fi Cards (Centrino and Centrino Duo Mobile Platforms). Contributions to technologies that changed the face of personal communications worldwide.
  • Designed and developed Intel’s first Integrated CMOS RF Power Amplifiers for Wi-Fi.
  • Managed full project lifecycle to increase long-term RF reliability and to limit performance degradation of Intel’s Centrino chips.
  • Developed highly complex Microwave Monolithic Integrated Circuit (MMIC) power amplifier design for the Israeli Ministry of Defense. Success of this design prompted the channeling of $10+ million by the Israeli Ministry of Defense and a ten-fold increase in engineering staff to incorporate millimeter-wave MMIC and high frequency packaging technology into military systems.

Recognition & Leadership

  • Mobile Wireless Group Divisional Recognition Award, Intel Corporation, 2011
  • Mobile Wireless Group Divisional Recognition Award, Intel Corporation, 2007
  • Electronic Systems Division Award for Excellence, RAFAEL, 1999
  • Electromagnetics Group Award, RAFAEL, 1998
  • Lady Davis Postdoctoral Research Fellow, Technion, 1991-1993
  • Eastman Kodak Scholarship Prize in Physics, Muhlenberg College, 1983
  • Previous Chairman, Israel Chapter, IEEE Solid State Circuit Society, 2008-2011
  • Member, Technical Program Committee, International IEEE RFIC Conference, 2008-2010
  • IEEE Senior Membership, 1999 - present
  • President, Alumni Club, Columbia University in Israel, 1995-1996


  • Ph.D., Electrical Engineering (Solid State Science and Engineering), Columbia University, 1991
  • M.S., Electrical Engineering, Drexel University, 1986
  • B.Sc., Physics, Muhlenberg College, 1983
  • U.S. Patent and Trademark Office
˘ Not admitted to the practice of law. Attorneys in the Tel Aviv office do not practice Israeli law.
  • Hebrew
  • English